Parts/Cooling/Direct water-cooled LSI (pre-cold-plate era)
Cooling · 2011
Direct water-cooled LSI (pre-cold-plate era)
Water reaching the CPU and other LSIs directly, described in period language rather than as a modern "cold plate" but the same underlying idea, seven years before the term reached this dataset's other systems.
Why this part
RIKEN's own description of K computer's cooling never uses the phrase "cold plate", but the mechanism it names, water cooling directly at the CPU and other LSIs, is the same underlying idea this dataset's dlc-cold-plate part describes for Summit and Sierra seven years later. The two are kept as separate parts rather than one because the vocabulary genuinely differs and forcing them together would misdate the technology's arrival in this dataset the same way reusing a 2018-labelled part for a 2011 machine would. RIKEN states the purpose plainly: lower chip temperature reduces failure rate and reduces power, the same argument every direct-to-chip system in this dataset makes about itself.
Systems using this part
- Systems
- 1
- Rmax underneath
- 10.51 PFlop/s
- Units recorded
- -
| System | Role | Country | Units | System Rmax | Supplied by | Rank |
|---|---|---|---|---|---|---|
| K computer 2011-06 | Cooling | Japan | - | 10.51 PFlop/s | Fujitsu | #1 → |
“Units recorded” sums only the edges where a public source states a quantity. It is a floor, not a total, and should never be read as installed base.