COMPUTE ATLAS Supercomputer supply-chain graph
1345 systems 511 sites Sourced data

Supercomputers/Analysis/Power and cooling

Analysis 08

Installed power by cooling architecture

63 of the 1345 systems here are directly liquid cooled, carrying 275 MW of the 911 MW this dataset records. The transition from air is not gradual: air cooling stops being physically capable somewhere around 20 kW a rack, and current cabinets are rated to twenty times that. This is the layer a ranking stops short of, and it is now more often the constraint on building the next machine than the silicon is.

Phase 1 seed dataset, compiled by hand. These rows were built from public operator, laboratory and vendor sources. A mechanical second-reader pass has since fetched every cited source: 1263 of 1345 systems have a readable citation that names them, and 56 are genuinely weakly sourced. Every claim carries its source and a confidence tier. Treat anything below verified as a lead, not a citation.

Read the shape, not the spikes. This is the installed base of the 1345 systems in this dataset: a curated seed chosen for supply-chain diversity, not a census of the market. At that sample size one machine entering or leaving service moves a share line by tens of points, so year-to-year jumps are composition effects rather than market events. The multi-year trends are the part worth quoting; the individual steps usually have one system's name on them, and the table view under the chart will tell you which.

  • Direct liquid cooling, warm water
  • Direct-to-chip cold plate
  • Air cooling (CRAC/CRAH)
  • Liquid-assisted air (in-cabinet coil)
  • Chilled-water indirect liquid cooling
  • Single-phase immersion
  • Direct water-cooled LSI (pre-cold-plate era)
  • Conduction-cooled liquid (primary/secondary loop)
  • Not recorded
Cooling architecture share of installed FLOPS, 1993–2026 Stacked area chart showing the share of installed Rmax running under each cooling architecture by year, with a band for systems where no architecture is recorded. Direct liquid cooling, warm waterDirect-to-chip cold plateAir cooling (CRAC/CRAH)Liquid-assisted air (in-cabinet coil)Chilled-water indirect liquid coolingSingle-phase immersionDirect water-cooled LSI (pre-cold-plate era)Conduction-cooled liquid (primary/secondary loop)Not recorded 0%25%50%75%100%19931998200320082013201820232026 Direct liquid cooling, warm waterNot recorded 1993 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 51.0% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 31.1% Not recorded 17.9%1994 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 43.0% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 26.3% Not recorded 30.7%1995 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 25.8% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 15.8% Not recorded 58.4%1996 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 29.8% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 6.5% Not recorded 63.8%1997 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 43.2% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 3.3% Not recorded 53.5%1998 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 19.4% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 1.5% Not recorded 79.2%1999 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 15.2% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 1.2% Not recorded 83.6%2000 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 8.1% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.6% Not recorded 91.3%2001 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 4.8% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.4% Not recorded 94.9%2002 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 49.4% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.1% Not recorded 50.5%2003 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 31.7% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 68.3%2004 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 68.8% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 31.2%2005 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 46.4% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 53.6%2006 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 39.1% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 60.9%2007 Direct liquid cooling, warm water 0.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 17.7% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 82.3%2008 Direct liquid cooling, warm water 3.5% Direct-to-chip cold plate 0.4% Air cooling (CRAC/CRAH) 56.7% Liquid-assisted air (in-cabinet coil) 0.0% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 39.4%2009 Direct liquid cooling, warm water 2.4% Direct-to-chip cold plate 0.3% Air cooling (CRAC/CRAH) 39.7% Liquid-assisted air (in-cabinet coil) 9.3% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 48.3%2010 Direct liquid cooling, warm water 1.6% Direct-to-chip cold plate 0.2% Air cooling (CRAC/CRAH) 25.7% Liquid-assisted air (in-cabinet coil) 6.1% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 66.5%2011 Direct liquid cooling, warm water 11.7% Direct-to-chip cold plate 0.1% Air cooling (CRAC/CRAH) 15.3% Liquid-assisted air (in-cabinet coil) 3.6% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 10.8% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 58.6%2012 Direct liquid cooling, warm water 27.0% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 5.9% Liquid-assisted air (in-cabinet coil) 15.2% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.0% Direct water-cooled LSI (pre-cold-plate era) 4.1% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 47.8%2013 Direct liquid cooling, warm water 16.7% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 3.5% Liquid-assisted air (in-cabinet coil) 9.1% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.1% Direct water-cooled LSI (pre-cold-plate era) 2.5% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 68.2%2014 Direct liquid cooling, warm water 14.8% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 2.7% Liquid-assisted air (in-cabinet coil) 8.1% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.1% Direct water-cooled LSI (pre-cold-plate era) 2.2% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 72.1%2015 Direct liquid cooling, warm water 12.4% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 2.1% Liquid-assisted air (in-cabinet coil) 6.3% Chilled-water indirect liquid cooling 0.0% Single-phase immersion 0.2% Direct water-cooled LSI (pre-cold-plate era) 1.7% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 77.3%2016 Direct liquid cooling, warm water 17.2% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 1.3% Liquid-assisted air (in-cabinet coil) 6.8% Chilled-water indirect liquid cooling 9.4% Single-phase immersion 0.1% Direct water-cooled LSI (pre-cold-plate era) 1.1% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 64.0%2017 Direct liquid cooling, warm water 16.2% Direct-to-chip cold plate 0.0% Air cooling (CRAC/CRAH) 2.0% Liquid-assisted air (in-cabinet coil) 11.6% Chilled-water indirect liquid cooling 7.2% Single-phase immersion 3.1% Direct water-cooled LSI (pre-cold-plate era) 0.8% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 59.1%2018 Direct liquid cooling, warm water 13.6% Direct-to-chip cold plate 22.9% Air cooling (CRAC/CRAH) 1.2% Liquid-assisted air (in-cabinet coil) 7.0% Chilled-water indirect liquid cooling 4.4% Single-phase immersion 1.9% Direct water-cooled LSI (pre-cold-plate era) 0.5% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 48.5%2019 Direct liquid cooling, warm water 12.3% Direct-to-chip cold plate 21.5% Air cooling (CRAC/CRAH) 1.1% Liquid-assisted air (in-cabinet coil) 6.3% Chilled-water indirect liquid cooling 3.9% Single-phase immersion 1.1% Direct water-cooled LSI (pre-cold-plate era) 0.4% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 53.4%2020 Direct liquid cooling, warm water 32.8% Direct-to-chip cold plate 12.9% Air cooling (CRAC/CRAH) 3.9% Liquid-assisted air (in-cabinet coil) 2.9% Chilled-water indirect liquid cooling 2.3% Single-phase immersion 0.6% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 44.6%2021 Direct liquid cooling, warm water 32.2% Direct-to-chip cold plate 10.5% Air cooling (CRAC/CRAH) 3.1% Liquid-assisted air (in-cabinet coil) 2.3% Chilled-water indirect liquid cooling 1.9% Single-phase immersion 0.5% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 49.6%2022 Direct liquid cooling, warm water 59.3% Direct-to-chip cold plate 5.6% Air cooling (CRAC/CRAH) 1.6% Liquid-assisted air (in-cabinet coil) 1.2% Chilled-water indirect liquid cooling 1.0% Single-phase immersion 0.3% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 31.0%2023 Direct liquid cooling, warm water 57.3% Direct-to-chip cold plate 3.7% Air cooling (CRAC/CRAH) 2.8% Liquid-assisted air (in-cabinet coil) 0.8% Chilled-water indirect liquid cooling 0.7% Single-phase immersion 0.2% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 34.5%2024 Direct liquid cooling, warm water 63.2% Direct-to-chip cold plate 2.4% Air cooling (CRAC/CRAH) 1.7% Liquid-assisted air (in-cabinet coil) 0.2% Chilled-water indirect liquid cooling 0.4% Single-phase immersion 0.1% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 32.0%2025 Direct liquid cooling, warm water 58.5% Direct-to-chip cold plate 0.8% Air cooling (CRAC/CRAH) 1.4% Liquid-assisted air (in-cabinet coil) 0.2% Chilled-water indirect liquid cooling 0.3% Single-phase immersion 0.1% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 38.8%2026 Direct liquid cooling, warm water 50.2% Direct-to-chip cold plate 0.1% Air cooling (CRAC/CRAH) 1.1% Liquid-assisted air (in-cabinet coil) 0.1% Chilled-water indirect liquid cooling 0.3% Single-phase immersion 0.1% Direct water-cooled LSI (pre-cold-plate era) 0.0% Conduction-cooled liquid (primary/secondary loop) 0.0% Not recorded 48.1%
Share of installed Rmax by cooling architecture. The grey band is systems where we have no recorded architecture: a gap in the dataset, not a category of machine.
Download this chart's data (CSV) ↓
Table view: Cooling architecture share of installed FLOPS
YearDirect liquid cooling, warm waterDirect-to-chip cold plateAir cooling (CRAC/CRAH)Liquid-assisted air (in-cabinet coil)Chilled-water indirect liquid coolingSingle-phase immersionDirect water-cooled LSI (pre-cold-plate era)Conduction-cooled liquid (primary/secondary loop)Not recordedInstalled total
19930.0%0.0%51.0%0.0%0.0%0.0%0.0%31.1%17.9%398.3 GFlop/s
19940.0%0.0%43.0%0.0%0.0%0.0%0.0%26.3%30.7%472.1 GFlop/s
19950.0%0.0%25.8%0.0%0.0%0.0%0.0%15.8%58.4%786.5 GFlop/s
19960.0%0.0%29.8%0.0%0.0%0.0%0.0%6.5%63.8%1.92 TFlop/s
19970.0%0.0%43.2%0.0%0.0%0.0%0.0%3.3%53.5%3.79 TFlop/s
19980.0%0.0%19.4%0.0%0.0%0.0%0.0%1.5%79.2%8.46 TFlop/s
19990.0%0.0%15.2%0.0%0.0%0.0%0.0%1.2%83.6%10.76 TFlop/s
20000.0%0.0%8.1%0.0%0.0%0.0%0.0%0.6%91.3%20.15 TFlop/s
20010.0%0.0%4.8%0.0%0.0%0.0%0.0%0.4%94.9%34.36 TFlop/s
20020.0%0.0%49.4%0.0%0.0%0.0%0.0%0.1%50.5%104.08 TFlop/s
20030.0%0.0%31.7%0.0%0.0%0.0%0.0%0.0%68.3%162.05 TFlop/s
20040.0%0.0%68.8%0.0%0.0%0.0%0.0%0.0%31.2%769.52 TFlop/s
20050.0%0.0%46.4%0.0%0.0%0.0%0.0%0.0%53.6%1.14 PFlop/s
20060.0%0.0%39.1%0.0%0.0%0.0%0.0%0.0%60.9%1.35 PFlop/s
20070.0%0.0%17.7%0.0%0.0%0.0%0.0%0.0%82.3%2.99 PFlop/s
20083.5%0.4%56.7%0.0%0.0%0.0%0.0%0.0%39.4%13.22 PFlop/s
20092.4%0.3%39.7%9.3%0.0%0.0%0.0%0.0%48.3%18.89 PFlop/s
20101.6%0.2%25.7%6.1%0.0%0.0%0.0%0.0%66.5%29.03 PFlop/s
201111.7%0.1%15.3%3.6%0.0%0.0%10.8%0.0%58.6%48.84 PFlop/s
201227.0%0.0%5.9%15.2%0.0%0.0%4.1%0.0%47.8%127.4 PFlop/s
201316.7%0.0%3.5%9.1%0.0%0.1%2.5%0.0%68.2%212.7 PFlop/s
201414.8%0.0%2.7%8.1%0.0%0.1%2.2%0.0%72.1%239.1 PFlop/s
201512.4%0.0%2.1%6.3%0.0%0.2%1.7%0.0%77.3%309.0 PFlop/s
201617.2%0.0%1.3%6.8%9.4%0.1%1.1%0.0%64.0%492.4 PFlop/s
201716.2%0.0%2.0%11.6%7.2%3.1%0.8%0.0%59.1%646.2 PFlop/s
201813.6%22.9%1.2%7.0%4.4%1.9%0.5%0.0%48.5%1.06 EFlop/s
201912.3%21.5%1.1%6.3%3.9%1.1%0.4%0.0%53.4%1.19 EFlop/s
202032.8%12.9%3.9%2.9%2.3%0.6%0.0%0.0%44.6%1.98 EFlop/s
202132.2%10.5%3.1%2.3%1.9%0.5%0.0%0.0%49.6%2.50 EFlop/s
202259.3%5.6%1.6%1.2%1.0%0.3%0.0%0.0%31.0%4.69 EFlop/s
202357.3%3.7%2.8%0.8%0.7%0.2%0.0%0.0%34.5%7.05 EFlop/s
202463.2%2.4%1.7%0.2%0.4%0.1%0.0%0.0%32.0%11.12 EFlop/s
202558.5%0.8%1.4%0.2%0.3%0.1%0.0%0.0%38.8%14.10 EFlop/s
202650.2%0.1%1.1%0.1%0.3%0.1%0.0%0.0%48.1%17.54 EFlop/s
How this was calculated, and the inference behind most of these rows

Same construction as the other share charts: each in-service system contributes its last reported Rmax to every year it was live, split evenly where more than one architecture is recorded.

Most cooling edges here are inferred from the integrator's cabinet platform, not stated per system. That inference is worth being explicit about. Operators publish core counts and interconnect families; they publish cooling far less consistently. But the cabinet determines the architecture: every HPE Cray EX cabinet is 100% direct liquid cooled, every BullSequana XH2000 and XH3000 is a direct liquid cooled platform, Lenovo's SD650 is Neptune warm water, the Cray XT/XE/XK/XC generations moved air across in-cabinet water coils.

So where the platform is unambiguous we record the architecture with the integrator as supplier, confidence: reported, and the basis written into the edge's raw_string (you can read "HPE Cray EX cabinet) 100% direct liquid cooled" on the system page and judge the inference yourself. Where the platform does not settle it, we record nothing. Nine systems have no cooling edge for that reason and appear in the “Not recorded” band rather than being assigned a plausible value.

Installed megawatts use power_kw where an operator has published it. Only 523 of 1345 systems do. A blank power figure means we found no source, not zero, so the megawatt totals below are a floor across the systems that disclose, never a census.

By architecture

ArchitectureSystemsDisclosing power InstalledMedian GF/WSpan
Not recorded 1244 465 546.7 MW 2.3 1965–2026
Direct liquid cooling, warm water 63 43 275.5 MW 14.8 2008–2026
Liquid-assisted air (in-cabinet coil) 6 5 29.1 MW 2.7 2009–2017
Direct-to-chip cold plate 11 3 18.2 MW 12.7 2008–2026
Chilled-water indirect liquid cooling 1 1 15.4 MW 6.1 2016–2016
Direct water-cooled LSI (pre-cold-plate era) 1 1 12.7 MW 0.8 2011–2011
Air cooling (CRAC/CRAH) 14 5 12.5 MW 1.4 1993–2024
Single-phase immersion 5 2 1.4 MW 9.3 2013–2019
Conduction-cooled liquid (primary/secondary loop) 1 0 - - 1993–1993
Cray-2 Fluorinert immersion cooling 1 0 - - 1985–1985
ETA10 liquid nitrogen cooling 1 0 - - 1987–1987

Do not read the GF/W column as a cooling effect. Warm-water systems show roughly seven times the median efficiency of the liquid-assisted-air generation, and almost all of that is confounded with time: the warm-water systems span 2008–2026 and the in-cabinet-coil ones 2009–2017. What actually changed over that window is the silicon. Cooling architecture followed rack density rather than causing the efficiency gain, and this dataset cannot separate the two.

By cooling supplier

The company that supplied the cabinet, rolled up to today's parent. On direct-liquid platforms the integrator supplies the cooling, which is why this table looks like the integrator table rather than like a list of thermal vendors.

Supplier (today's parent)SystemsDisclosing powerInstalled
Hewlett Packard Enterprise 37 26 181.7 MW
Atos 19 15 45.4 MW
Fujitsu 5 3 44.2 MW
IBM 9 9 38.5 MW
NRCPC 1 1 15.4 MW
Vertiv 1 1 15.0 MW
Lenovo 13 7 11.7 MW
NVIDIA 2 1 2.6 MW
ExaScaler 3 2 1.4 MW
NEC 2 1 1.2 MW
GRC (Green Revolution Cooling) 1 1 1.2 MW
MEGWARE 2 1 0.5 MW
RSC Group 2 1 0.3 MW
Cray Computer Corporation 1 1 0.1 MW
Eurotech 1 1 0.1 MW
Institute of Science Tokyo 1 1 0.0 MW
Intel 2 0 -
Thinking Machines 1 0 -
Hitachi 1 0 -
Dell Technologies 2 0 -
Supermicro 1 0 -
Crusoe 3 0 -
Meta Platforms 2 0 -
DUG Technology 1 0 -
ETA Systems 1 0 -
TensorWave 1 0 -
IREN 1 0 -
Applied Digital 1 0 -
Vantage Data Centers 2 0 -
Related Digital 1 0 -
Hypertec Cloud 2 0 -
Sugon 1 0 -
Cerebras 1 0 -
Scala Data Centers 1 0 -
G42 1 0 -
Schwarz Digits 1 0 -
NEXTDC 1 0 -
Austrian Scientific Computing 1 0 -
DKF 1 0 -
RIKEN 1 0 -
Compute Nordic Finland 1 0 -
EdgeConneX 1 0 -
Samsung SDS 1 0 -
evroc 1 0 -
Pure DC 1 0 -
BDx Data Centers 1 0 -
TCS HyperVault 1 0 -
NFD Korea 1 0 -

The read

The chart has one clean transition and one honest hole.

The transition is physical rather than commercial. Air carries roughly 3,500 times less heat per unit volume than water, and the fan power needed to move it scales with about the cube of velocity. A hall handles 5 to 10 kW a rack comfortably and 20 kW with effort; a current accelerator cabinet is 40 to 400 kW. There was no decision point at which the industry preferred liquid: there was a density at which air stopped being an option. The Cray XT/XE/XC generation is the visible intermediate step: air, but moved across a water coil inside the cabinet.

The hole is the “Not recorded” band, and it is 1244 systems wide. It sits mostly in the early years and among the machines whose operators published least, which is the same shape as the wider problem. This is the thinnest layer of the dataset precisely because it is the layer nobody discloses, and that is the argument for recording it at all.

What the megawatt column cannot show is the part that now binds. Of the 511 sites here, 12 publishes a PUE and almost none publish substation capacity or utility. Yet lead times on medium-voltage switchgear and large transformers have run to years, and in several markets the utility interconnection queue is measured in multi-year increments. The constraint on the next generation of machines is increasingly a piece of electrical infrastructure that no ranking has ever had a column for.

The power and cooling chapter covers the engineering in detail: how warm-water cooling removes the chillers, what PUE conceals, and why heat reuse works in Kajaani and not in Arizona.